MediaTek today announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This high-end offering offers a performance boost over Dimensity9000, making flagship smartphones even more powerful.
The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4nm octa-core process, combining one ultra-Cortex-X2 core operating at up to 3.2GHz (compared to 3.05GHz with the Dimensity 9000) with three super Cortex-A710 cores and four efficiency Cortex-A510 cores. The chipset features an advanced CPU architecture, Arm Mali-G710MC10 GPU processor, and more than a 10% increase in GPU performance.
“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “With a suite of top-tier AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming and an all-around better user experience.”
The Dimensity 9000+ is the latest addition to the Dimensity 9000 series of flagship smartphone chipsets, which are designed for the growing bandwidth demands of the mobile market. The integrated LPDDR5X supports 8MB L3 CPU cache and 6MB of system cache. Additionally, the chipset integrates MediaTek’s fifth generation Application Processor Unit (APU 5.0) for powerful AI computing capabilities in a power-efficient design.
The MediaTek Dimensity 9000+ has the following key features:
- MediaTek Imagiq 790The 18-bit HDR ISP is the flagship model that supports 320MP and simultaneous triple-camera 18-bit HDR video recording. The 9Gpixel/s ISP supports 4K HDR Video +AI noise reduction, enabling the highest quality results in extreme low-light situations.
- Leading 3GPP release-16 5G modem: The integrated 5G modem amplifies sub-6GHz performance up to 7Gbps downlink using 3CC Carrier Aggregation (300MHz) and supports R16 UL enhancement. The Dimensity 9000+ also integrates 5G/4G Dual SIM Dual Active support and MediaTek’s 5G UltraSave 2.0 power-saving enhancement suite for improved efficiency.
- MediaTek MiraVision 770: The Dimensity 9000+ supports the latest 144Hz WQHD+ displays or super-fast 180Hz FullHD+ displays, while optimizing power efficiency with MediaTek’s Intelligent Display Sync 2.0 technology. Furthermore, MediaTek’s latest Wi-Fi Display technology can support up to 4K60 HDR10+ video.
- Wi-Fi 6E and New GNSS with Beidou III – B1C, as well as New Bluetooth 5.3: Smartphone users can enjoy seamless connectivity thanks to the chip’s support for the latest Wi-Fi, Bluetooth and GNSS standards.
Smartphones powered by the MediaTek Dimensity 9000+ are expected to be released in Q3 2022.